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MT2625处理器资料介绍(datasheet)_低功耗_单位

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MTK MT2625是一种高度集成的芯片组,具有运用场置器、低功耗的多波段窄带物联网收发器和电源管理单元(PMU)。

MT2625基于ARM Cortex-M4,带有浮点微掌握器单元(MCU),集成了4MB pSRAM和4MB闪存。
MT2625还支持UART、I2C、SPI、I2S、PWM等接口。
SDIO、ADC、USB、键盘和USIM。

MT2625处理器资料介绍(datasheet)_低功耗_单位 互联网

NB-物联网收发器包含3 GPP R13/R14无线电、基带和MAC,旨在知足低功耗和延长电池寿命的运用哀求。

MT2625处理器特点:

NB-IoT transceiver

• Compliant with 3GPP R13/R14 NB-IoT standard

• Supports DL 200kHz bandwidth/UL single tone and multi-tone

• Supported RF bands:

B1/B2/B3/B5/B8/B11/B12/B13/B17/B18/B19/B20/B21/B25/B26/B28/B31/B66/B70/B71

• Supports PSM and eDRX mode

Microcontroller subsystem

• ARM Cortex-M4 with FPU and MPU

• 14 DMA channels

• One RTC timer, one 64-bit and five 32-bit general purpose timers

• Development support: SWD, JTAG

• Crypto engine

---AES 128, 192, 256 bits

---DES, 3DES

-- MD5, SHA-1, 224, 256, 384, 512

• True random number generator

• JTAG password protection

Memory

• Up to 32KB SYSRAM, with zero-wait state

• Up to 32KB L1 cache, with high hit rate and zerowait state

• Embedded 32Mbits flash

---Sleep current 200nA

• Embedded 32Mbits pseudo SRAM

--- Sleep current 10µA

Communication interfaces

• Two SDIO 2.0 masters and one SDIO 2.0 slav

Three I2C (3.4Mbps) interfaces

• Four UART interfaces (3Mbps, UART1/2 with hardware flow control)

• Two SPI masters and one SPI slave

• Two I2S interfaces

---One 16/24-bit, master/slave mode;One 16-bit, master/slave mode with TDM

---Both support 16, 24, 48, 96, 192kHz and

11.025kHz, 22.05kHz, 44.1kHz, TX/RX, 2 channels

• Four PWM channels

• 37 GPIOs (5V-tolerant)

• Seven IOs for BPI and MIPI interfaces

• Three IOs for SIM

• 5 channel 10-bit AUXADC (PinMux with GPIO), maximum input voltage 1.4V

• Embedded thermal sensor

Power management

• Three integrated high efficiency buck converters with low quiescent current

• Four integrated LDO regulators for RTC, SIM, RF frontend and GPIOs

• Operating temperature from -40°C to 85°C

Clock source

• 26MHz crystal oscillator

• 32kHz crystal oscillator or internal 32kHz oscillator for RTC

Package

• 5.6-mm x 5.6-mm x 1.05-mm TFBGA with 0.5-mm ball pitch

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